- Over the last 18+ years, Advinno has been involved in layouts on many analog and mixed-signal chips. Advinno has been involved in tape outs targeted to 14nm/10nm/7nm process nodes. Advinno team has experience with TSMC, UMC, Global, Intel Foundries. The team has expertise in SerDes, PMUs, RF designs, Memories, Data Converters, and IOs Design Specification
Expertise
- Block level and full chip layouts
- Floor planning, Placement, Routing
- Matching transistor pairs
- Shielding critical nets
- EM&IR analysis and repair
- DRC/LVS
- Full chip integration
- Expertise in ADC/DAC, PLL, DLL, LNA, IOs, Serdes, DC/DC Converters, Oscillators, Memories, PMUs and RF layouts
- Foundries: Expertise in TSMC, UMC, Global Foundries, Tower Jazz, X-Fab, Micrel, Dongbu and Samsung
- Process Nodes: 500nm all the way down to 16nm/14nm/10nm/7nm
- Expertise in Bulk CMOS, SOI and BCD processes
Analog and Mixed-Signal Design
Our Analog and Mixed Signals Design Methodology and Services help you to create first-pass-success analog and mixed signal chips with shortest-time to market.
- Design Specification
- Circuit Entry
- Circuit Simulation
- Layout Entry
- Layout Extraction
- Layout Verification
- Tape out
The trend to outsource design work is increasing as companies focus on their core competencies. We help companies to minimize risks, costs and design cycles.
Design Experiences & Capabilities
Our broad area of expertise is listed below:
- Analog to Digital Converters (ADCs)
- Digital to Analog Converters (DACs)
- Low Noise Amplifiers (LNA)
- Bandgap Voltage References
- Phase Lock Loops (PLL)
- High Speed I/Os